黑料网

Abstract

3D chip stacking is a cutting-edge technology in the semiconductor industry that aims to overcome the limitations of traditional 2D integrated circuits. By vertically stacking multiple layers of chips and interconnecting them, 3D chip stacking promises to significantly enhance the performance, reduce the size, and lower the power consumption of electronic devices. This article explores the principles of 3D chip stacking, its benefits, challenges, and applications, and highlights its potential to revolutionize fields such as high-performance computing, mobile devices, and artificial intelligence.