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Srikant Nekkanty
Srikant Nekkanty
Senior Packaging R&D Engineer
Intel Corporation
USA
Biography
Srikant Nekkanty Ph.D., Integrated Systems Engineering: The Ohio State University, Columbus, OH 03/2009 Dissertation: Characterization of damage and optimization of thin film coatings on ductile substrates M.S., Mechanical Engineering: The Ohio State University, Columbus, OH 12/2002 Thesis: Characterization of Indentation Damage to Boron carbide/DLC Coatings B.Tech., Mechanical Engineering: Institute of Engineering & Technology, Kanpur Univ., India 06/2000
Research Interest
Mechanics of Materials,Medical and Bioengineering,Semiconductor Industry,
