ºÚÁÏÍø

ISSN: 2277-1891

International Journal of Advance Innovations, Thoughts & Ideas
ºÚÁÏÍø

Our Group organises 3000+ Global Events every year across USA, Europe & Asia with support from 1000 more scientific Societies and Publishes 700+ ºÚÁÏÍø Journals which contains over 50000 eminent personalities, reputed scientists as editorial board members.

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Elenti Petkert

Infrastructure development, construction, and urban planning, Kazakh National Technical University, Kazakhstan
Publications

3D Chip Stacking: Revolutionizing Semiconductor Design for Higher Performance and Efficiency

3D chip stacking is a cutting-edge technology in the semiconductor industry that aims to overcome the limitations of traditional 2D integrated circuits. By vertically stacking multiple layers of chips and interconnecting them, 3D chip stacking promises to significantly enhance the performance, reduce the size, and lower the power consumption of ele... Read More»

Elenti Petkert

: Int J Adv Innovat Thoughts Ideas: 13:6: 301

10.4172/2277-1891.1000301

Abstract Peer-reviewed Full Article Peer-reviewed Article PDF Mobile Full Article

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