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3D Chip Stacking: Revolutionizing Semiconductor Design for Higher Performance and Efficiency
3D chip stacking is a cutting-edge technology in the semiconductor industry that aims to overcome the limitations of traditional 2D integrated circuits. By vertically stacking multiple layers of chips and interconnecting them, 3D chip stacking promises to significantly enhance the performance, reduce the size, and lower the power consumption of ele... Read More»
: Int J Adv Innovat Thoughts Ideas: 13:6: 301
10.4172/2277-1891.1000301Abstract Peer-reviewed Full Article Peer-reviewed Article PDF Mobile Full Article
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